Compression interconnect technology, which is used to connect two parallel surfaces, is very important in demanding high-speed applications in the computer, telecommunications and aerospace markets. Cinch’s compression interconnect technology is solderless and utilizes compression style hardware to align and hold the components together. Cinch offers two connector technologies to meet the most challenging interconnect needs: CIN::APSE®, a unique wound contact and Cinch iQ™, a patented stamped metal contact.


AESA Radar, Missile Guidance System, Space, Satellite, Advanced Test Equipment, High I/O count devices , Chip package to board, Land Grid Array(LGA), Flex to board, component to board