CINCH ModICE™ is a sealed packaging solution for rugged electronic control module (ECU) applications. ModICE™ offers the entire packaging for the electronics: A plastic enclosure and connector. The connector is integrated into the face plate (header) and snaps into the enclosure to make a sealed assembly. All the customer has to do is place the PCB into the ModICE™ package. No need to develop/tool a custom enclosure. ModICE™ is a quick to market, inexpensive, yet robust and reliable solution for the electronic designer.